General specification for Multi-layer printed circuit board

1, 4-38 layers
2, Board finished thickness: 0.3mm-7.0mm
3, Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen Free, Rogers, Telfon.
4, Max. Finished board size: 23*25(580*900mm)
5, Min. Drilled hole size: 6mil(0.15mm)
6, Min. Line width: 3mil(0.075mm), Min. Line spacing: 3mil(0.075mm)
7, Surface finish/treatment: HASL/HASL lead free, Chemical tin, ENIG,Immersion Silver, OSP, etc.
8, Copper thickness: 0.5-20 oz
9, Solder mask color: Green/yellow/black/white/red/blue
10, Copper thickness in hole: >25.0 um(>1mil)


12L multilayer pcb
Technical description, 
Material: FR-4 Tg170
Board thickness: 1.6mm 
Surface finished: Immersion gold+Controlled Impedance
Copper thickness: 1 Oz for all layers 
Min.line width/space: 4mil
Min through hole: 0.15mm